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      Technical Support
      FAQ
      What is different between Low Pressure Molding and Epoxy Potting?

      PA Hot melt LPM

      Epoxy molding

      Case

      Need

      Meed case

      Working temperature

      -70~150℃

      180℃

      Housing

      No need housing

      Need housing

      Cycle time

      2-60 seconds

      Chemical reaction needs 24 hours

      density

      0.98

      Above 1.2

      Curing

      Much less curing time

      Need curing

      Working space

      Occupy less space

      Occupy large space

      Energy consumption

      Low

      High

      Resin consumption

      Less

      Much more

      Process

      Simple

      Complex

      Vacuum pumping

      No need

      Need 

      Hits:  UpdateTime:2018-09-14 15:08:00  【Printing】  【Close
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