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      Technical Support
      Technical Support
      FAQ

            Some common problems in electronic waterproof protection technology are listed below for reference. Due to the influence of various factors such as the requirements of product structure and use environment in the actual application process, the problems encountered and corresponding solutions are also different. For any technical support, please contact us.

      What the Benefits of Low Pressure Molding?

      LPM can over-mold extensively products and enhance product performance.LPM technology benefits mainly reveal in two aspects below: 

      Product Performance

      • Environmentally friendly (RoHS).

      • Water-proof. 

      • Electrical insulation.

      • Mechanical protection from impact. 

      • Resistance to temperature (UL94 V-0).

      • Resistance to Chemical. 

      Production

      • Simplify the process, enhance productivity.

      • Shorten the development cycle, reduce the R&D cost.

      • Save production space.

      • No hazardous materials during production.

      • Thermoplastic no cure time and increased reliability.

      • Molds design flexibility.

      What is the Application of Low Pressure Molding?

           Low pressure molding technology can be applied to wide range of industries and any unique product that needs to be sealed and protected against the environment such as PCB, automotive electronics, automotive wire, connector, sensor, micro switch etc.

           More Application details: http://www.cheltiq.com/q_case/img.php?lang=en&class1=329

      What is different between Low pressure molding and Traditional molding?

            LPMS selects high performance hot-melt adhesive, which has excellent mobility. The adhesive takes very small pressure to make it flow to mold, therefore, the products successfully over-molded without causing any harm in the process, greatly reducing the defect product.


      PA Hot melt LPM

      Traditional molding

      Material

      PA Hot melt resin

      ABS、PBT、PP

      Injection pressure

      1.5~40 bar

      350~1,300 bar

      Injection temperature

      190~230℃

      230~300℃

      Clamping force

      1 Ton

      Over 50 Tons

      Mould material

      Steel and aluminum

      Only steel

      Damage to the mold

      No damage

      Wear and tear

      Injection machine

      Air cylinder driven

      Hydraulic driven

      What is different between Low Pressure Molding and Epoxy Potting?


      PA Hot melt LPM

      Epoxy molding

      Case

      Need

      Meed case

      Working temperature

      -70~150℃

      180℃

      Housing

      No need housing

      Need housing

      Cycle time

      2-60 seconds

      Chemical reaction needs 24 hours

      density

      0.98

      Above 1.2

      Curing

      Much less curing time

      Need curing

      Working space

      Occupy less space

      Occupy large space

      Energy consumption

      Low

      High

      Resin consumption

      Less

      Much more

      Process

      Simple

      Complex

      Vacuum pumping

      No need

      Need 

      How much is the shrinkage rate of material after low pressure injection molding?

             Low pressure molding material’s shrinkage rate is slightly lower than  traditional molding material. Low pressure molding contraction ranges between 1%~1.5%. It depends on materials.

      How to avoid air bubbles in the product?

      • Mold structure design, such as increasing the exhaust inserts, the way of injection.

      • Mold DFM.

      • For larger injection volume products, we might design multiple injection to avoid it.

      • Using transparent resin to test and adjust molding parameters through mold trial and small production of the samples.

      Leave a Message
      If you have any problems of waterproof for electronic products, please fill in the following form. Our professional team will contact you and provide you with the waterproof solution for electronic products。
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